Industry News | 2019-05-01 20:22:28.0
ITW EAE is proud to announce that it has earned a coveted VA Excellence Award for the Patented Dynamic Dual Head (DDH) dispensing technology for the Camalot Prodigy Dispenser. The Award was presented during the 13th Vision Awards program at Nepcon China.
Industry News | 2013-03-26 17:09:31.0
The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.
Industry News | 2003-07-01 08:52:13.0
Dedicated to advancing the understanding and practice of MSD control in electronic assembly procedures and practices.
Industry News | 2021-05-04 11:12:30.0
The SMTA is pleased to announce the International Conference for Electronics Hardware Enabling Technologies (ICEHET) is scheduled 2-3 June 2021 as an express virtual event.
Industry News | 2021-06-15 04:44:00.0
The SMTA is pleased to announce that registration for the International Conference for Electronics Hardware Enabling Technologies (ICEHET) is open with on-demand access available until September 1, 2021.
Industry News | 2018-03-14 18:46:31.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2010-08-17 11:07:25.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, recently redesigned its PB Swiss Tools storefront to coordinate with the manufacturer’s new marketing strategy “Work with the best.” The new site, located at www.pbtools.us, features fresh new graphics and diagrams to allow users to easily locate products and services.
Industry News | 2012-03-22 19:12:37.0
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
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