Industry News: 8.0 (Page 3 of 4)

BTU International Reports Second Quarter 2009 Results

Industry News | 2009-07-28 16:38:07.0

NORTH BILLERICA, Mass., Jul 28, 2009 (BUSINESS WIRE) -- BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes to the alternative energy and electronics manufacturing markets, today announced its financial results for the second quarter, which ended on June 28, 2009.

BTU International

Advance in Semiconductor Technology Points the Way to Higher Functionality, Lower-Cost Electronic Products

Industry News | 2001-12-03 07:45:41.0

Motorola to Preview Next-Generation 0.10 micron CMOS Technology and New Gate Dielectric Material at World's Leading Semiconductor Device Conference

Motorola Mobility LLC.

Parvus� to Release its SpacePC� 4500 Single Board Computer, a Fanless, PC/104-Plus 400MHz Celeron� CPU with Full Intel� Architecture

Industry News | 2004-06-23 10:54:01.0

Ruggedized embedded computer board to offer extended temperature operation, shock/vibration resistance, and low power consumption for demanding embedded systems apps

Parvus Corporation

Mycronic Introduces Industry’s Fastest Jet Dispensing Platform at Productronica 2015

Industry News | 2015-11-09 13:17:35.0

Mycronic is again expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. At Productronica 2015 (November 10-13, Munich Trade Fair Center) the company will demonstrate new high-speed and high-precision jet dispensing capabilities for the MY600, making it the fastest dispensing platform on the market.

Mycronic Technologies AB

Mycronic Introduces Industry's Fastest Jet Dispensing Platform at IPC APEX 2016

Industry News | 2016-03-07 14:00:21.0

Mycronic is expanding the capabilities of its highly versatile MY600 solder paste jet printing platform. At IPC APEX EXPO 2016 the company will demonstrate new high-speed and high-precision jet dispensing capabilities for the MY600, making it the fastest dispensing platform on the market.

Mycronic Technologies AB

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Orbotech Announces First Quarter 2003 Results

Industry News | 2003-05-13 08:22:33.0

Revenues for the first quarter of 2003 totaled $54.2 million, compared to the $51.1 million recorded in the first quarter a year ago.

Orbotech

Henkel reports substantial increase in sales and earnings in the second quarter

Industry News | 2010-08-09 15:22:28.0

“Following a very good start to fiscal 2010, we have now seen our operations continue their successful development in the second quarter, with our Adhesive Technologies and Cosmetics/Toiletries business sectors making a particularly strong contribution..."

Henkel Electronic Materials

Henkel shows positive trend in Q2

Industry News | 2009-08-07 14:21:05.0

“Again in the second quarter of 2009, Henkel felt the effects of the continuing world economic recession. Nevertheless, all our business sectors were again able to outstrip their relevant markets,” said Kasper Rorsted, Chairman of the Henkel Management Board. “Our Laundry & Home Care business sector actually surpassed the good results of the first quarter, while Cosmetics/Toiletries again showed a very positive performance.

Henkel Electronic Materials

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