Industry News: 88mm motorized feeder (Page 10 of 15)

ESSEMTEC’s Cobra SMT Assembler Wins another Industry Award

Industry News | 2011-11-20 12:53:18.0

Essemtec has been awarded a Global Technology Award in the category of Pick-and-Place Equipment - Low-Medium Volume for its Cobra SMT Assembler.

ESSEMTEC AG

Metcal Brings the Latest Innovation in Hand Soldering to NEPCON China

Industry News | 2017-03-23 13:05:52.0

Metcal today announced plans to exhibit at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase its convection rework and hand soldering systems and tools, including the new CV-5200 Connection Validation™ Soldering Station and High Thermal Demand upgrade kit in Stand 1H39.

Metcal

Altus Sees Increased Interest in Yamaha’s Innovative Surface Mounter Following SMT Hybrid Expo

Industry News | 2017-07-06 10:10:41.0

Since supporting Yamaha Motor Europe IM at the SMT Hybrid Packaging show in Nuremberg, Germany last month, Altus, a leading distributor of capital equipment for electronics assembly, has seen an increased interest in the company’s most recent surface mounter equipment.

Altus Group

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Industry News | 2017-10-16 19:59:28.0

Essemtec will present a large all-in-one platform that can be used for the assembly of high-speed applications, rapid prototyping and high-speed dispensing at productronica 2017. The company will exhibit in Hall A3, Booth 218, Nov. 14 – 17, 2017 at the Messe München in Germany. With different modules, the system can grow synchronously with customer requirements for performance and processes.

ESSEMTEC AG

Next Generation HSP Chipshooter Now Available

Industry News | 2001-01-29 14:50:16.0

Universal Instruments' next generation turret-style chipshooter, the 4797 HSP- originally showcased as a prototype last March at APEX 2000 - is now available as a standard production model to electronics manufacturers worldwide.

Universal Instruments Corporation

MANNCORP �HI OUTPUT� TURNKEY LINE TARGETS MID TO HIGH-VOLUME FLEXIBLE SMT ASSEMBLY

Industry News | 2008-07-19 12:18:17.0

An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The �Hi Output Line� also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. According to CEO Henry Mann, �The 10,500 cph placement speed allows mid-volume assemblers to step-up throughput while benefitting from the increased savings and service advantages of purchasing the entire line from a single-source provider.�

Manncorp

Thermaltronics New Solder RobotSelected for 2020 GLOBAL Technology Award

Industry News | 2020-10-03 08:46:12.0

Thermaltronics USA, Inc. received a 2020 GLOBAL Technology Award in the category of Soldering Robots for its TMT-R8000S. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

Thermaltronics USA, Inc.

Thermaltronics Receives Second Award for New Solder Robot

Industry News | 2020-10-27 12:37:44.0

Thermaltronics USA, Inc. received a 2020 Mexico Technology Award in the category of Soldering – Robotic for its TMT-R8000S. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Thermaltronics USA, Inc.

Essemtec Opens New Demo and Training Center in Suzhou, China

Industry News | 2008-09-30 22:07:25.0

Essemtec, the leading Swiss manufacturer of highly flexible production systems for electronics, announces that it has opened a new customer training center in Suzhou, China. Automatic and semiautomatic SMD production equipment is installed for demos, education and evaluation.

ESSEMTEC AG

Mycronic introduces the MYPro A40: an evolutionary high-speed, high-flexibility pick-and-place platform

Industry News | 2023-10-23 10:11:59.0

Mycronic is introducing its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead technology. The new platform, which increases top placement speeds by 48% while handling a significantly wider range of component types and sizes, will be launched at Productronica 2023 in Munich.

Mycronic AB


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