1 a new stencil rulebook for wafer level solder ball place result

Industry News: a new stencil rulebook for wafer level solder ball place (Page 1 of 1)

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

  1  

a new stencil rulebook for wafer level solder ball place searches for Companies, Equipment, Machines, Suppliers & Information