Industry News: acceptable scrap rate (Page 1 of 16)

New Service has PCB Cleaning Down to a Fine Art

Industry News | 2003-06-26 09:02:38.0

The surface quality of printed circuit boards and components directly impacts performance and product life.

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NEMI Launches DPMO Project

Industry News | 2003-05-02 08:49:07.0

Group to Assemble Data by Package and Technology Type

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Cookson Assembly Materials Announces Price Increase

Industry News | 2003-02-24 09:54:40.0

Effective March 3, Cookson Electronics Assembly Materials (Jersey City, NJ) will increase prices for its products by an average of 3 percent, the company announced today.

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Wire-to-board Range Handles Up To 16A

Industry News | 2003-05-12 09:19:51.0

No larger than conventional 12A wire-to-board connectors for PCB applications

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Photronics Names John Chin Vice President - Asia

Industry News | 2003-07-09 09:00:46.0

He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.

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NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

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parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

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DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

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Teradyne Introduces Optima 7210 Optical Process Test 'OPT' System

Industry News | 2003-04-02 09:03:49.0

Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation

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Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

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