Industry News | 2024-09-16 18:48:43.0
KYZEN is proud to announce that it has been awarded two prestigious 2024 Mexico Technology Awards. KYZEN received recognition in the category of Cleaning Materials for its KYZEN SLV901 and in the category of Process Control Tools for the KYZEN ANALYST². The award ceremony was held on Sept. 11, 2024 before the start of SMTA Guadalajara.
Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2012-04-04 15:31:23.0
Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
Industry News | 2014-01-30 19:32:01.0
Gen3 Systems Limited today announced that it will exhibit at Southern Manufacturing 2014 on stand K38. Southern Manufacturing is scheduled to take place on February 12-13, 2014 at FIVE in Farnborough, Hampshire.
Industry News | 2015-06-29 16:26:30.0
Specialty Coating Systems (SCS) is pleased to announce that it will host an educational webinar entitled, “Ultra-thin Conformal Coatings: Enhancing Component Protection and Reliability” on Thursday, July 23, 2015, at 2:00 p.m. ET | 11:00 a.m. PT. The webinar will be conducted by Rakesh Kumar, PhD, SCS Vice President of Technology, and Tim Dietrich, Sr. Customer Service Manager, and will be available for registration at SCSwebinars.com.
Industry News | 2019-04-01 19:37:06.0
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in³) large-volume F3-S process chamber that can be configured for larger strips or can treat more strips per cycle, yielding higher throughput and increased productivity for semiconductor and electronics packaging.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2012-10-03 16:39:08.0
Aqueous Technologies Corpannounces that CEO Michael Konrad will present at the upcoming Long Island SMTA Expo and Technical Forum.
Industry News | 2017-09-12 20:15:18.0
SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.
