Industry News: acf bond (Page 2 of 2)

New G4C Ceramic Hot Bars (Thermodes)

Industry News | 2014-07-16 20:05:16.0

Backward Compatible G4C Ceramic Hot Bars Designed for Legacy TC-1000 and TC-1200 Toddco Temperature Controllers

Toddco3

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

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