Industry News: acoustic scanning (Page 1 of 1)

Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

Industry News | 2017-04-23 11:52:40.0

Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.

Microtronic GmbH

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Microtronic GmbH Enters Distribution Agreement with Pemtron for Scanning Electron Microscopes

Industry News | 2017-04-05 11:18:26.0

Microtronic GmbH is pleased to announce that it has added the PEMTRON PS™ Series Scanning Electron Microscopes (SEMs) to its product line up in parts of the EU. The PS Series Models include the PS-210 Compact Desk Top Mini-SEM, the PS-230 High Performance Normal-SEM, and PS-250 Analytical Normal-SEM.

Microtronic GmbH

Microtronic to Display Range of Products at SMT/Hyrbid/Packaging 2015

Industry News | 2015-04-07 15:34:16.0

Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Microtronic GmbH

Microtronic to Exhibit at the IMAPS EMPC in Germany

Industry News | 2015-09-03 15:44:25.0

Microtronic today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as well as specialty solders from AIM.

Microtronic GmbH

Nordson Test & Inspection's New SpinSAM™ AMI System Wins Prestigious Global Technology Award

Industry News | 2024-11-04 15:17:53.0

Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the Test Equipment category. The award was announced at a ceremony during SMTA International.

Nordson Corporation

Nordson Test & Inspection Will Show Industry-Leading X-ray, Component Counting, AOI & Acoustic Imaging Systems at SMTAI

Industry News | 2021-10-07 15:27:04.0

Nordson Test & Inspection, part of the Nordson Corporation (Nasdaq: NDSN),will exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Visit Booth #3413 to learn more about Nordson's comprehensive range of Test and Inspection systems including:

Nordson Corporation

Nordson Test & Inspection Unveils Latest Inspection and Metrology Solutions at SEMICON West 2025

Industry News | 2025-10-01 16:51:02.0

Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2025, scheduled to take place October 7-9th at the Phoenix Convention Center in Arizona. Visitors to booth 5745 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and 4800 Integra Bond Tester.

Nordson Corporation

Nordson Test & Inspection Launches Advanced Inspection and Metrology Solutions at Productronica & SEMICON Europa 2025

Industry News | 2025-11-03 14:30:58.0

Nordson TEST & INSPECTION today announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the Messe Munchen in Munich, Germany. Visitors to SmartTec's booths #A2.540, A2.537 and HTT's booth # B1.102 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, SQ5000™Pro Multi-Function system for AOI, SPI and CMM, Quadra Pro™ Manual X-Ray system (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and X3 Automated X-Ray (AXI) system with Dynamic Planar CT.

Nordson Corporation

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