Industry News | 2010-11-24 12:20:52.0
Seika Machinery announces that NIX OF AMERICA’s NIKKO POWER CYCLONE reduces costs with longer lasting brushes. Unlike adhesive roller type cleaners, the NIKKO POWER CYCLONE requires minimum supervision and the brush needs to be replaced only once a year.
Industry News | 2010-10-22 11:11:09.0
Seika Machinery releases NIX OF AMERICA's NIKKO POWER CYCLONE. The inline cyclone quickly and efficiently removes dust and particulates from PCB surfaces before solder application.
Industry News | 2017-11-29 14:28:56.0
Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.
Industry News | 2022-10-06 17:57:45.0
Seika Machinery, Inc. is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. Seika will highlight the following equipment in Booth #1012: Malcom PCU-285 Viscometer, McDry Storage Cabinets, Sayaka CT23NJ PCB Router, Malcom RCX Series Modular Reflow Oven Profiling System and Unitech UC-250M-CV PCB Cleaner.
Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2017-01-09 17:45:07.0
Seika Machinery will exhibit in Booth #2409 at the 2017 IPC APEX EXPO, scheduled to take Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Seika will showcase a complete line up of leading-edge equipment, including the McDry HM-100BNF N2 Auto-Purge Model, Sawa Ecobrid SC-AH100 Fully Automatic Low-VOC Stencil Cleaner, Sayaka CT23NJ PCB Router, HIOKI FA1240 Flying Probe Tester, DEN-ON RD500V, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer.
Industry News | 2018-03-07 07:37:28.0
Nordson MARCH announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2020-09-01 12:27:21.0
Seika Machinery, Inc. is pleased to announce its participation in the SMTA International Virtual Conference & Exposition. The Live Virtual Expo is scheduled to take place Sept. 28-30, 2020. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2019-10-18 10:46:46.0
Seika Machinery, Inc. today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. Seika will highlight leading-edge equipment, including the latest models from SAWA, Unitech and MALCOM in Booth #620.
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