Industry News: adhesive witness mark on every board (Page 1 of 2)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Essemtec’s FLX2011-MK Places Smaller Components on Flexible Circuits

Industry News | 2009-07-17 19:02:35.0

The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.

ESSEMTEC AG

Insituware Brings Charlie Kempner on Board as North American Sales Manager

Industry News | 2021-10-21 05:22:55.0

Insituware LLC is pleased to announce Charlie Kempner as its new North American Sales Manager.

Insituware LLC

Nordson DAGE Introduces a New Method for Testing Thin Die in Accordance to the SEMI Standard G96-1014 Additional capability for Micro Materials Test applications on the 4000Plus platform

Industry News | 2014-12-11 17:22:23.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.

Nordson DAGE

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Industry News | 2008-02-19 10:11:00.0

Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.

i3 Electronics

Preview for Seica Inc. – Las Vegas, Nevada, IPC Apex March 15-17, 2016, booth # 2310 In the ramp light: Automation and Industry 4.0

Industry News | 2016-02-03 12:04:47.0

The theme for Seica at Apex this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system; its Mini line of benchtop ATE, and the Firefly line, a premier laser selective soldering system.

3M Electrical Solutions Division

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

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