Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2017-03-21 15:05:07.0
Techcon Systems will exhibit in Stand 1H39 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The Techcon team will demonstrate the TS8100 Series Positive Displacement PC Pump, TS9000 Jet Valve, TS9300HM Hot Melt Valve, and TSR2201 Dispensing Robot.
Industry News | 2017-07-17 19:09:09.0
Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.
Industry News | 2019-01-16 09:48:30.0
Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
Industry News | 2008-03-25 23:59:52.0
Comment from Tetsuro Nishimura, North American Sales Manager
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2012-05-01 19:12:41.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference
Industry News | 2019-12-10 23:09:42.0
Company owners can now enjoy the various environmental chambers presented by Symor instrument Equipment Co.,Ltd, which includes Temperature Test Chamber, Temperature Humidity Chamber,IP Test Chamber,Ozone Aging Test Chamber, and Salt Spray Corrosion Test Chambers, etc.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
