Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2008-01-31 16:45:57.0
Milton, NY � January 31, 2008 � Sono-Tek Corporation, the world leader in the development and application of ultrasonic atomization technology and spraying and coating application systems, announces that it will introduce the SonoDry 1000 spray drying system in booth 1639 at the upcoming INTERPHEX 2008 exhibition and conference scheduled to take place February 14-15, 2008 at the Puerto Rico Convention Center in San Juan, Puerto Rico.
Industry News | 2011-05-19 21:01:56.0
Christopher Associates Inc. today introduced two new solder pastes formulated for use in LED manufacturing.
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
Industry News | 2009-05-20 19:22:57.0
EAST WINDSOR, CT � MAY 2009 � friendlygreen.org, a resource created to offer commercial clients alternatives in sustainable, green technologies, and operational efficiency enhancements, announces that effective immediately, all friendly green� pre-saturated wipes will be delivered to customers using its own cotton, non-woven fabric. This change will replace the current Novatech NT1 material used in the product since its inception.
Industry News | 2019-01-14 19:51:49.0
Finetech will demonstrate the new SMART DESOLDER 01 at the upcoming IPC APEX Conference scheduled for January 29-31 in San Diego (booth #2427).
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2011-05-12 22:13:47.0
Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
