Industry News: advanced and technologies and cat-90 (Page 10 of 98)

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Industry News | 2017-07-23 20:13:17.0

SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK's Next Generation Dispensing and Conformal Coating Systems and Software to be on Display at IPC APEX 2016 Booth 1841

Industry News | 2016-03-09 16:11:24.0

Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.

ASYMTEK Products | Nordson Electronics Solutions

Evolving Technologies Summit Focuses on Printed Electronics, Packaging Technology, and Materials at SMTA International

Industry News | 2013-07-23 16:35:08.0

The SMTA announced that the Evolving Technologies Summit will be held on October 14, 2013 as a focused symposium at SMTA International in Fort Worth, Texas.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK to Exhibit New Conformal Coating Line and Dispensing Solutions with SmartTec GmbH and in the Fraunhofer IZM Future Packaging Line at SMTconnect

Industry News | 2019-04-30 18:05:43.0

Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.

ASYMTEK Products | Nordson Electronics Solutions

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2019-07-16 19:36:51.0

The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging Conference (IWLPC). The conference will be held October 22-24, 2019 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Industry News | 2017-07-19 15:29:48.0

The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

eSMART Factory Conference Addresses New Processes and Systems for “Smart” Manufacturing

Industry News | 2019-04-23 07:36:42.0

SMTA announces registration is now open for the 2nd Annual eSMART Factory Conference on June 20-21, 2019 at the Dearborn Inn in Dearborn, MI, USA. Co-organized by Global SMT & Packaging magazine and SMTA, this conference brings together the key technologies shaping the electronics manufacturing industry including software systems and processes, augmented reality and alternative systems.

Surface Mount Technology Association (SMTA)

Cleaning, Military and Printed Electronics, Solderability and Reliability Highlight IPC APEX EXPO Technical Conference 35 technical sessions with nearly 100 research papers

Industry News | 2012-12-14 06:50:53.0

e IPC APEX EXPO® Technical Conference will cover two dozen technical topics in the areas of board fabrication, design and electronics assembly.

Association Connecting Electronics Industries (IPC)

IPC Announces Agenda for Component Technology Conference September Event to Target 3-D and Other Interconnection Solutions

Industry News | 2013-06-20 19:24:42.0

IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 24th

Industry News | 2017-07-10 21:03:59.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)


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