Industry News: advanced flipchip technologies (Page 4 of 661)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

MIRTEC Wins a 2009 Global Technology Award at Productronica

Industry News | 2009-11-11 12:29:12.0

OXFORD, CT — November 2009 — MIRTEC announces that it has been awarded a second consecutive Global Technology Award in the category of Inspection-AOI Systems.

MIRTEC Corp

MIRTEC Partners with Southwest Systems Technology, Inc.

Industry News | 2019-01-08 20:24:41.0

MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce the appointment of Southwest Systems Technology, Inc. as its manufacturers’ representative. With offices in Texas and Mexico, Southwest Systems Technology will provide sales and support for MIRTEC’s award-winning inspection systems in the states of Texas, Oklahoma, Arkansas and Louisiana.

MIRTEC Corp

Nextek Expands Production Operations

Industry News | 2003-06-25 12:49:17.0

Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies

SMTnet

MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab

Industry News | 2019-10-21 16:37:01.0

MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

MIRTEC Corp

MIRTEC RECEIVES A GLOBAL TECHNOLOGY AWARD AT SMTAI FOR ITS TECHNOLOGICALY ADVANCED MV-9 2D/3D AOI SERIES

Industry News | 2012-10-17 14:13:01.0

MIRTEC, “The Global Leader in Inspection Technology”, announces that it has been awarded a 2012 Global Technology in the category of Inspection – AOI for its revolutionary MV-9 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology

MIRTEC Corp

MIRTEC Wins 2020 GLOBAL Technology Award for Its All-New MV-6Z OMNI 3D AOI Machine

Industry News | 2020-10-03 08:42:18.0

MIRTEC received a 2020 GLOBAL Technology Award in the category of Inspection – AOI Systems for its MV-6Z OMNI 3D In-Line AOI system. This represents the 12th Global Technology Award presented to MIRTEC for its Technologically Advanced Inspection Solutions. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

MIRTEC Corp

MIRTEC TO PREMIER ITS TECHNOLOGICALLY ADVANCED AUTOMATED OPTICAL INSPECTION EQUIPMENT AT IPC MIDWEST 2012

Industry News | 2012-07-25 09:56:58.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it will premier its technologically advanced AOI equipment

MIRTEC Corp


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