Industry News | 2015-01-21 08:30:44.0
A leading SMT equipment manufacturer has concluded an important contract with Essemtec AG for the supply of 100 Cubus systems to be delivered in the coming 12 months. The first systems have been delivered to Southeast Asia and to multiple sites in Europe.
Industry News | 2015-01-21 21:29:26.0
A leading SMT equipment manufacturer has concluded an important contract with Essemtec AG for the supply of 100 Cubus systems to be delivered in the coming 12 months. The first systems have been delivered to Southeast Asia and to multiple sites in Europe.
Industry News | 2015-04-22 14:46:47.0
Essemtec AG announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Automatic Component Warehouse Systems for its Cubus Next-Generation SMT Storage System. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2023-04-03 13:41:12.0
Heraeus Electronics is pleased to announce the development of a production friendly, flexible passive component termination ink. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus' solution offers easier shipping, storage, and handling at room temperatures.
Industry News | 2015-04-06 12:41:41.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
Industry News | 2015-08-24 15:21:44.0
Essemtec today announced that it will exhibit in Booth #335 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Parquda G2 multifunctional center and Cubus storage system.
Industry News | 2015-03-10 11:09:24.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2023-12-11 12:44:13.0
The Belen, NM, USA site opened in 1983 and has been processing responsibly mined bentonite clay into desiccant packets and bags for the past 40 years
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
