Industry News: ag0 (Page 1 of 3)

Jasbir Bath Joins IPC as Principal Engineer

Industry News | 2012-10-05 16:48:23.0

IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.

Association Connecting Electronics Industries (IPC)

Two Indium Corporation Experts to Present “Best Papers” at SMTA South China Technology Conference 2018

Industry News | 2018-08-16 20:05:44.0

Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China.  Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.

Surface Mount Technology Association (SMTA)

Wave soldering welding interview direct contact with high temperature liquid in the production

Industry News | 2018-10-18 09:29:21.0

Wave soldering welding interview direct contact with high temperature liquid in the production

Flason Electronic Co.,limited

SMT reflow oven process principle and introduction

Industry News | 2018-10-18 09:42:39.0

SMT reflow oven process principle and introduction

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Christopher Associates and Koki Announce Patented S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste

Industry News | 2011-01-26 20:33:39.0

Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.

Christopher Associates Inc.

Christopher Associates' Jasbir Bath to Present during Technical Session at IPC Midwest

Industry News | 2011-09-14 11:38:51.0

Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder, will present “A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low-Silver Solder Alloys” at the upcoming IPC Midwest Conference & Exhibition.

Christopher Associates Inc.

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Industry News | 2011-12-30 23:26:12.0

Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

Nihon Superior Co., Ltd.

Christopher Associates’ Jasbir Bath to Moderate Low Silver Alloys Meeting at IPC APEX 2010

Industry News | 2010-03-30 14:16:46.0

Christopher Associates, a pioneering supplier and distributor to the electronics and photovoltaic industries announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will moderate Session S23, titled "Low Silver Alloys,: at the upcoming IPC/APEX conference and exhibition.

Christopher Associates Inc.

Nihon Superior's High Ductility Lead-free Solder Provides High Impact Strength

Industry News | 2009-03-06 15:54:16.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.

Nihon Superior Co., Ltd.

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