Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2013-10-28 16:16:34.0
SMTA International Conference and Exhibition, which took place October 13-17, 2013 at the Fort Worth Convention Center in Fort Worth, TX, experienced a 30% increase in registration coming in at over 1,300 and a 45% increase in on-site attendance compared to 2012.
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
Industry News | 2011-04-22 22:48:40.0
IPC has released verified attendance figures from IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas, indicating an eight percent increase over last year with 7,208 total participants.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2018-12-08 03:35:10.0
Top 10 Consumer Electronics Companies in the World
Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Industry News | 2019-12-16 22:47:11.0
The difference between gas phase reflow welding and hot air reflow welding is that gas phase reflow welding USES vapor phase liquid to heat the key.
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