Industry News | 2014-08-12 16:03:12.0
(Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.
Industry News | 2015-11-18 13:15:58.0
Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.
Industry News | 2014-07-08 11:04:03.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2014-06-18 16:22:16.0
YINCAE is honored to accept this 2014 Best of Albany Awards for Manufacturers. YINCAE is the leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. It is very rewarding to know that local businesses and customers recognize YINCAE as an outstanding business. YINCAE will continue to serve and please the community as well as the customers. Customer satisfaction is the foundation of our company and YINCAE will continue ensure that every customer is more than satisfied with our product.
Industry News | 2014-06-10 11:59:03.0
(Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2017-08-08 09:40:36.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2018-07-19 15:26:39.0
(Albany, NY) July 16, 2018: YINCAE is excited to announce that we will be attending the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition in San Jose, CA this year from October 23rd-25th at the Double Tree by Hilton. This conference brings together many of the top performers in the semiconductor industry and addresses all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing
