Industry News | 2011-10-12 20:28:30.0
Kyzen announces that Ram Wissel will present “Solubility Theorems” at SMTA’s Penang Expo & Technical Forum.
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2014-02-21 10:31:01.0
STI Electronics, Inc.announces that Mel Parrish will lead the Product Assurance Committee at IPC APEX EXPO on Monday, March 24, 2014 from 8-9 a.m. at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2015-06-18 17:27:00.0
ViTrox Technologies held a successful User Group Meeting (UGM) at Evotest, Inc. in San Jose, Calif. More than 20 customers participated in this event.
Industry News | 2015-11-11 09:14:38.0
FlashRunner™ In-System Programmer (ISP) line from SMH Technologies supports PIC16LF15548051s from Microchip;
Industry News | 2011-10-21 13:28:46.0
Kyzen will highlight METALNOX® M6319 and M6309LT in Booth #3261 at the upcoming FABTECH exhibition
Industry News | 2010-04-28 14:16:13.0
NASHVILLE - Kyzen, a world leading provider of environmentally responsible cleaning products for high reliability and high-technology manufacturing operations, will highlight METALNOX® M6319 in booth 1705 at the upcoming METALFORM Mexico, scheduled to take place May 11-13, 2010 at Centro Banamex in Mexico City.
Industry News | 2010-09-13 15:47:54.0
Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, announces that it held a successful two-day training seminar for its manufacturers’ representatives. The training was held August 25-26, 2010 at Bliss’ headquarters in Milpitas, Calif.
Industry News | 2011-06-22 00:31:49.0
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of a significant revision of its standard for Inspection Criteria for Microelectronic Packages and Covers, JESD9B.
Industry News | 2012-04-27 14:46:36.0
The Balver Zinn/Cobar Group introduces Tempotac (120-TEM), its newest next-generation tacky flux.
