Industry News: alpha and issues (Page 2 of 44)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Latest Advancements in Safety and Reliability Requirements in Medical, Auto and Aerospace Applications Take Center Stage at IPC's High Reliability Forum

Industry News | 2023-08-21 12:08:58.0

The critical reliability of electronic prosthetics in the brain to help restore movement to a paralyzed hand, enhancing the durability of EV automotive infrastructure, testing criteria and challenges of working with lead-free materials, and evaluation of reliability and maintainability for safe airborne structures are just a few of the agenda items offered at IPC's High Reliability Forum October 17-19 in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

ALPHA-electronik A/S, First European Company to Renew Qualified Manufacturers Listing for IPC J-STD-001 and IPC-A-610

Industry News | 2019-08-04 20:30:07.0

IPC's Validation Services Program has awarded and renewed an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to ALPHA-electronik A/S, an ISO9001 and ISO13485 certified EMS-based company in Denmark. Following an IPC audit, Alpha-electronics became the first European company to successfully renew and complete an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Honors Apple, Inc. and MacDermid Alpha Electronic Solutions with Corporate Recognition Awards

Industry News | 2022-02-07 17:16:04.0

IPC presented its highest corporate honors to two IPC member companies, Apple Inc., and MacDermid Alpha Electronic Solutions during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions, and the Stan Plzak Corporate Recognition Award was presented to Apple, Inc.

Association Connecting Electronics Industries (IPC)

SMTA and Auburn University CAVE

Industry News | 2003-04-21 10:31:32.0

Co-sponsoring Harsh Environments Workshop

Surface Mount Technology Association (SMTA)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2014-02-18 17:01:34.0

The SMTA is pleased to announce the program for the 2014 International Conference on Soldering and Reliability being held May 13-15 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Solar Manufacturing and Reliability Conference Program Announced

Industry News | 2012-01-19 23:41:13.0

SMTA and SEMA announced the finalized program of the Solar Manufacturing & Reliability Conference taking place March 22-23, 2012 in San Jose, CA. The program will consist of presentations and discussion covering the reliability testing of PV Modules covering gaps and where future work needs to be done.

Surface Mount Technology Association (SMTA)

Understanding Environmental and Conflict Minerals Regulations

Industry News | 2013-04-16 15:45:33.0

Get information on developing industry practices at IPC Conflict Minerals Update and It’s Not Easy Being Green conferences

Association Connecting Electronics Industries (IPC)

Bangkok Events to Focus on Solderability, Assembly and Reliability Workshop and free technical conference scheduled for November

Industry News | 2013-10-01 18:16:06.0

A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)


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