Industry News: aluminum core pcb (Page 11 of 51)

NEO Tech Releases New LTCC & AlN Design Guidelines

Industry News | 2018-03-13 16:34:13.0

NEO Tech announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.

NEO Technology Solutions (NEO Tech)

NEO Tech to Focus on Space-Qualified Capabilities during Space Tech Expo 2019

Industry News | 2019-05-15 17:09:30.0

NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.

NEO Technology Solutions (NEO Tech)

ECT Offers ZIP® Z0 and Z1 Contacts in HyperCoreTM Base Material

Industry News | 2013-11-20 16:36:43.0

Everett Charles Technologies (ECT) announced today that the .4mm and .5mm ZIP® Z0 and Z1 performance production contacts are now available in the high-performance HyperCore™ base material.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)

Tropical Stencil Enhances Products, Adds Full-Service Sourcing

Industry News | 2012-09-24 16:23:06.0

Tropical Stencil, a leading provider of laser cut stencils, recently has added several new product enhancements, along with full service printed circuit board (PCB) sourcing.

Tropical Stencil

ADLINK CoreModule® 920 with 3rd Generation Intel® Core™ Processor Delivering Highest Performance at Low Power

Industry News | 2013-03-13 13:36:45.0

ADLINK Technology releases its newest Extreme Rugged™ CoreModule® offering. The ADLINK CoreModule® 920, with outstanding mechanical, thermal and power design, is able to support Intel® Core™ i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.

ADLINK Technology, Inc.

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Industry News | 2015-12-28 17:22:37.0

Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

LED MCPCBs

Industry News | 2009-10-27 15:51:02.0

Metal Core LED Circuit Boards

Saturn Electronics Corporation

Tropical Stencil Is Twice as Nice — Exhibiting in TWO Booths at SMTA International 2012

Industry News | 2012-09-13 19:50:44.0

Tropical Stencilwill highlight its Laser Cut Stencil and E-formed, Nickel and Stepped Stencils, along with its full line of printed circuit boards in booths #504 and #215 at the upcoming SMTA International Conference and Expo

Tropical Stencil

NEW LOW PROFILE LINEAR MOTOR STAGE

Industry News | 2008-11-20 11:29:41.0

low profile, high precision, linear stage model LT190-EDLM.

Steinmeyer, Inc

VisionMaster Masters 3-D SPI with the Introduction of the M500

Industry News | 2012-09-07 14:49:58.0

VisionMaster, Inc debuts the M500 Manual 3-D SPI system.

VisionMaster, Inc.


aluminum core pcb searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830

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PCB Handling Machine with CE

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