Industry News | 2018-10-18 10:17:48.0
How to attach a thermocouple to a target PCB?
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2013-10-31 11:53:09.0
Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2018-01-28 16:15:48.0
Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2015-07-21 08:01:30.0
KYZEN’s will exhibit in booth #A-1P01 at NEPCON South China 2015, scheduled to take place August 25-27, 2015 at the Shenzhen Convention & Exhibition Center. KYZEN’s team will display the globally acclaimed, advanced technology AQUANOX® A4708, which already has won three industry awards since its debut earlier this year.
Industry News | 2015-11-01 18:53:43.0
KYZEN announces that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 5, 2015 at The Grand Event Center. The KYZEN team will be available to answer cleaning questions, and will have the AQUANOX® A4708 pH Neutral Electronic Assembly Cleaning Chemistry on display.
Industry News | 2022-04-06 11:58:04.0
Indium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse™ mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse™ Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Industry News | 2019-05-15 17:09:30.0
NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.
