Industry News | 2017-06-07 12:04:53.0
PDR is pleased to introduce its new aluminum clad PCB rework tools for LED rework, flex circuit rework and aluminum clad circuit card assemblies. Designed to be incorporated into PDR’s existing line-up of Focused IR Rework Machines, PDR’s new Hot Plate series incorporates all of the best attributes of PDR technology into a contact heating system, thereby efficiently providing the thermal energy necessary to tackle the widest range of applications possible.
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
Industry News | 2019-02-09 20:43:45.0
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2016-05-21 08:04:11.0
Oak-Mitsui are proud to announce an expanded strategic partnership adding Oak Mitsui’s proprietary ABC (aluminum bonded copper) to Insulectro’s premier product portfolio including CAC (copper aluminum copper). By leveraging their bicoastal manufacturing locations, ABC will continue to manufacture its bonded product in Hoosick Falls, NY and Insulectro will continue to manufacture CAC at its facility in Lake Forest, CA. The complete line of Oak-Mitsui copper foils, on CAC and ABC, will be available in Insulectro’s inventory by June 17, 2016.
Industry News | 2015-06-22 13:17:54.0
Insulectro (www.insulectro.com), a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.
Industry News | 2021-01-05 10:53:32.0
New Yorker Electronics Releases new Exxelia 560P High-Temp Capacitors with Longer Lifetime and Operating Temperatures to 180°C
