Industry News | 2013-07-30 12:55:21.0
Omni Circuit Boards, a British Columbia-based circuit board manufacturer, has announced the successful development of an aluminum monometal wire-bonded circuit board. The prototype, designed and manufactured for use in a D-Wave Systems quantum supercomputer, allows for superconductivity and operation in low temperatures just above absolute zero.
Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
Industry News | 2013-03-07 11:20:46.0
Semikron (SEMIKRON International GmbH) manufactures components and systems for power electronics.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2003-06-19 09:00:08.0
Leading provider of manufacturing services applies
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2003-04-16 10:58:03.0
Award presented for Palomar's Gold Connection
Industry News | 2016-06-15 19:49:11.0
Computrol today announced that it has purchased and installed an Assembléon iFlex T2 and two iFlex H1s from Kulicke & Soffa. The lane iFlex T2 is a multifunctional or line-balancing solution with a large component range. The iFlex H1 end-of-line solution offers odd-form and gripper capabilities.
Industry News | 2004-10-26 20:19:02.0
Passive Cooling of Intel XEON Processors
Industry News | 2015-01-27 10:29:53.0
Nihon Superior recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.
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