Industry News | 2015-02-22 17:49:35.0
Practical Components has added the WALTS Co., LTD to its extensive line of Dummy Components and Test Boards. Headquartered in Fukuoka, Japan, WALTS Co., LTD. develops and provides advanced test element group wafers (TEG) die/test kits. Their high-technology wafers are used extensively worldwide in wide ranging applications. WALTS collaborates on research with academic institutes on advanced assembly technologies. WALTS offers film sputtering and deposition, backgrinding, dicing service on test wafer/glass.
Industry News | 2014-06-25 12:31:01.0
Panasonic Factory Solutions Company of America will debut a process-flexible flip chip bonder at this year’s Semicon West as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.
Industry News | 2014-07-29 12:36:04.0
Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.
Industry News | 2014-02-04 15:04:31.0
Creyr Innovation has been selected by Panasonic Factory Solutions Company of America as a value-added sales representative for microelectronics solutions in the New England area.
Industry News | 2012-01-17 15:25:04.0
LPKFwill be exhibiting in booth #570 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
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