Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2010-01-21 15:16:41.0
NASHUA, NH, USA -- Microscan Technologies, Inc. (NASDAQ:PWAV), the Global Technology Leader in Precision Data Acquisition and Control Solutions, showcased the expansion of its worldwide operations with the grand opening of its newest R & D manufacturing facility located in Nashua, NH USA.. The ribbon cutting ceremony took place on 14th January 2010 gathering a select group of key customers and media representatives.
Industry News | 2003-03-14 08:54:29.0
The action is part of its continuing efforts to serve its many loyal customers, the company said.
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Industry News | 2010-02-01 13:36:36.0
Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.
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