Industry News | 2010-03-27 19:35:44.0
BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2015-09-02 12:29:02.0
ADLINK Technology today announced the first of fourteen new products in various form factors based on the 6th generation Intel® Core™ i7/i5/i3 processors (codename Skylake) and latest Xeon® processors, coming to market in the second half of 2015 and early 2016. These current Intel® processor-based offerings feature an updated 14nm microarchitecture and added support for Ultra HD 4K resolution displays.
Industry News | 2010-02-08 12:11:13.0
OSAKA, JAPAN — February 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.
Industry News | 2019-09-30 15:04:28.0
Datest will exhibit at the Northwest Electronics Design and Manufacturing Expo (NEDME, a.k.a. OctoberBest), scheduled to take place Wednesday, Oct. 2, 2019 at Tektronix in Beaverton, OR, from 9AM until 4PM
Industry News | 2007-10-09 00:22:12.0
SEOUL, South Korea--(BUSINESS WIRE)--Oct. 8, 2007--PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics, dramatically strengthens its portfolio of protein analysis and imaging technologies with the introduction of five new products at the Human Proteome Organization's (HUPO) 6th Annual World Congress in Seoul, South Korea, Oct. 6-10.
Industry News | 2006-05-11 09:34:07.0
Purchase of Danish TraceXpert Concluded
Industry News | 2016-04-21 19:06:25.0
ADLINK Technology today announced two new solutions based on the Intel® Xeon® Processor E5-2600 Product Family (codename Broadwell-EP). These latest ADLINK offerings are based on 14nm technology-based, server-class Intel® processors that bring intelligence to the edge for IoT applications, and include an AdvancedTCA® processor blade and network appliance from our Modular Industrial Cloud Architecture (MICA) offering. The new products target networking, communications, security and other data center applications where ruggedness is critical and compute requirements are intense.
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