Industry News | 2016-04-20 18:39:31.0
Saki Corporation will present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016, held from April 26-28, at the Shanghai World Expo & Exhibition Center, in stand 1J25. Technical experts will be at the booth to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.
Industry News | 2008-09-30 22:07:25.0
Essemtec, the leading Swiss manufacturer of highly flexible production systems for electronics, announces that it has opened a new customer training center in Suzhou, China. Automatic and semiautomatic SMD production equipment is installed for demos, education and evaluation.
Industry News | 2013-03-22 11:10:14.0
CyberOptics Corporation (Nasdaq: CYBE) will present its newest range of SPI and AOI inspection solutions in its representative HumanTek’s booth E-125 in Hall C at SMT/PCB & NEPCON Korea, scheduled to take place April 3-5, 2013 at the Coex Convention & Exhibition Center in Seoul, South Korea.
Industry News | 2019-01-22 12:41:53.0
Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2014-07-28 21:55:58.0
Viscom announced today that they will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in China.
Industry News | 2011-12-02 18:17:59.0
Productronica was particularly eventful and successful for Yestech-Europe this year. Having recently strengthened their presence in Germany with full local sales and support, they used the show to unveil significant new products for both AXI and AOI inspection.
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
Industry News | 2006-05-04 17:10:10.0
Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products
