Industry News: aoi and ppm (Page 3 of 38)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

Saki Presents 3D AOI Side-Angle Optics and Lighting Technology at NEPCON Thailand, Booth 6D11 and 6D12

Industry News | 2016-06-19 20:07:24.0

Saki Corporation will present its 3D automated optical inspection (AOI) equipment with innovative side-angle cameras and ring lighting technology at NEPCON Thailand 2016, held June 22-25, 2016, at BITEC in Bangkok, Thailand. Saki's 2D AOI system for simultaneous double-sided PCB inspection will also be on display.

SAKI America

Saki America Presents True 3D Automated Optical Inspection and Measurement Systems at SMTAI Booth #1025

Industry News | 2015-09-23 16:38:42.0

Saki Corporation announces presentations of its true 3D automated optical inspection (AOI) and measurement equipment at the Surface Mount Technology International (SMTAI) Show, being held in Rosemont, IL on September 29-30, 2015 at booth #1025. Saki's BF-3Di AOI System doesn't just inspect, it provides measurement of each component for heights from 0 to 20mm, with 1-micron height resolution.

SAKI America

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Industry News | 2021-08-26 11:02:27.0

SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

Shenmao Technology Inc.

Saki Corporation Exhibits 3D AOI and SPI Systems at SMT Hybrid Packaging

Industry News | 2015-04-21 17:10:49.0

Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.

SAKI America

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

Saelig Launches New Crystal Oscillators With Four Switchable Frequencies and Low Jitter

Industry News | 2018-03-01 11:43:19.0

The Euroquartz QuikXO HC_JF series of switchabl, high performance clock oscillators are available in CMOS, CML, HCSL, LVPECL or LVDS versions, with the unique ability to switch between four output frequencies.

Saelig Co. Inc.

Cogiscan and MIRTEC Announce Partnership

Industry News | 2012-12-06 11:18:16.0

Cogiscan, announces a strategic partnership with MIRTEC.

Cogiscan Inc.

Saki Presents "From Inspection to Measurement" at Productronica, Stand A2.239

Industry News | 2015-11-04 20:05:54.0

Saki Corporation announces that its new 3D automated optical inspection, solder paste, and x-ray technology and equipment will be demonstrated at Productronica 2015, in Stand A2.239, as part of the theme "From Inspection to Measurement."

SAKI America


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