Industry News | 2014-10-01 15:59:00.0
PCB provider Cirtech Electronics located in Cape Town, South Africa will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid. Bidding for the auction will open promptly at 8:00am PDT on October 7th, 2014 and will begin closing at 6:00am PDT on October 14th, 2014.
Industry News | 2014-10-10 16:27:51.0
CB provider Cirtech Electronics will be liquidating their assets utilizing the online auction services of GoIndustry and Baja Bid.
Industry News | 2024-09-16 18:52:11.0
PEMTRON is pleased to announce that its D2 (Dual Lane & Dual Head) Series AOI and SPI system has received a Mexico Technology Award in the category of Inspection Equipment – SPI Systems. The award was announced during a ceremony that took place on Wednesday, September 11, 2024 during SMTA Guadalajara in Mexico.
Industry News | 2024-09-23 20:27:15.0
PEMTRON is pleased to announce plans to exhibit at the TPCA Show, scheduled to take place Oct. 23-25, 2024 in Taipei, where it will showcase its latest innovations in inspection equipment. Visitors to Booth will have the opportunity to explore four state-of-the-art systems: POSEIDON, 8800AI, 8800FI and JUPITER, each designed to enhance precision, efficiency and quality control.
Industry News | 2024-09-30 20:02:53.0
PEMTRON is pleased to announce its participation in NEPCON Nagoya 2024, where it will showcase its cutting-edge equipment designed for precision inspection in semiconductor and electronics manufacturing. From October 23-25, visitors to PEMTRON's booth will experience demonstrations of the JUPITER 3D X-ray Inspection System, POSEIDON Wafer Warpage Measurement and FC-BGA Bump Inspection System, APOLLON Package Inspection System, and the 8800WIR Wafer Inspection System.
Industry News | 2016-04-04 09:33:43.0
Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.
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