Industry News | 2011-02-07 15:59:43.0
Lattice Semiconductor Corporation today announced the immediate availability of five new comprehensive Intellectual Property (IP) Suites to accelerate the design of electronic systems in a variety of industries using the award winning LatticeECP3™ FPGA family.
Industry News | 2010-01-22 20:47:53.0
WOBURN, MA ? January 2010 ? Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that Bob Steel, North American Sales Manager, and Greg Leblonc, Application and Flying Probe Product Manager, will hold a seminar on advances in limited access testing.
Industry News | 2010-01-22 20:51:30.0
WOBURN, MA ? January 2010 ? Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that Bob Steel, North American Sales Manager, and Greg Leblonc, Application and Flying Probe Product Manager, will hold two seminars on advances in limited access testing.
Industry News | 2010-02-18 20:46:59.0
WOBURN, MA ? February 2010 ? Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, announces that Bob Steel, North American Sales Manager, and Greg Leblonc, Application and Flying Probe Product Manager, will hold two seminars on advances in limited access testing.
Industry News | 2002-04-03 08:53:57.0
Enabling Embedded System Designers to Significantly Increase Productivity and Accelerate Time-to-market
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2009-05-04 16:06:53.0
REDMOND, Wash. � May 1, 2009 � Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that the company completed a sales representative agreement with Process Automation & Tool, LLC to represent Data I/O in the Georgia, Alabama, Tennessee and Mississippi electronics assembly markets.
Industry News | 2009-06-05 07:47:18.0
Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening
Industry News | 2017-04-11 21:21:11.0
KYZEN today announced plans to participate in the Contamination, Cleaning & Coating Conference, scheduled to take place May 22-24, 2017 in Amsterdam. The event is co-organized by SMTA and SMART Group. Mike Bixenman, DBA, KYZEN Corporation will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” in Session I entitled “Residues Trapped under Component Terminations”. All presentations in this session will address a common question faced by OEMs when designing electronic hardware: How clean is clean enough?
Industry News | 2010-09-28 11:12:52.0
BPM Microsystems announces that it will highlight model 2800, the newest edition to its manual universal device programmer family, in booth 316 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
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