Industry News | 2014-03-20 09:56:25.0
MIRTECannounces that Jaltek Systems, located in Bedfordshire, UK, has selected its MV-7 OMNI 2D/3D In-Line AOI Machine.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2009-06-16 12:26:28.0
New Five-Day Class Teaches Practical as well as Lecture
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Industry News | 2022-02-10 16:44:57.0
The SMTA is currently seeking student applications for the Charles Hutchins Educational Grant by April 29, 2022.
Industry News | 2022-10-20 06:56:33.0
SMTA is honored to announce Rajesh Sharma Sivasubramony, a graduate student at Binghamton University, has been selected as the winner of the 2022 Charles Hutchins Educational Grant.
Industry News | 2017-08-08 13:41:02.0
SMTA announces that Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium on Monday, September 18, 2017. The symposium is part of the SMTA International technical conference September 17 - 21, 2017 in Rosemont, Illinois. Bader’s presentation is titled “2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years.”
Industry News | 2016-03-18 11:53:18.0
In recognition of her extraordinary contributions to IPC and the electronics industry, Patricia (Patty) Goldman, managing editor, I-Connect007, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® at the Las Vegas Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
Industry News | 2012-10-05 16:48:23.0
IPC — Association Connecting Electronics Industries® announces that Jasbir Bath of Bath and Associates Consultancy LLC, has joined the staff on a project basis as a principal engineer within IPC’s assembly technology area.
Industry News | 2012-01-13 13:27:59.0
The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?
