Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2024-09-16 18:36:04.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
Industry News | 2019-05-12 19:13:21.0
SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy. PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys.
Industry News | 2024-11-25 14:28:40.0
SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the "Reverse Hybrid" assembly process. This new approach is revolutionizing board assembly technology by offering a superior alternative to traditional low-temperature soldering techniques, enhancing both yield rates and reliability.
Industry News | 2013-08-14 11:42:55.0
From September 4-6, 2013, visit Kyzen in booth 106 at SEMICON Taiwan to learn more about its advanced cleaning solutions. Information about both MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry will be available in Kyzen’s booth at the TWTC Nangang Exhibition Hall in Taipei City, Taiwan.
Industry News | 2014-05-31 13:05:49.0
Kyzen announces plans to exhibit in Booth #5752 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2014-08-05 09:24:40.0
Kyzen will exhibit MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in booth 1226 at SEMICON Taiwan, which is scheduled to take place at TWTC Nangang Exhibition Hall in Taipei City, Taiwan from September 3-5, 2014.
Industry News | 2014-08-05 09:27:30.0
Kyzen will exhibit MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in booth 1226 at SEMICON Taiwan, which is scheduled to take place at TWTC Nangang Exhibition Hall in Taipei City, Taiwan from September 3-5, 2014.
Industry News | 2022-09-08 06:51:46.0
Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
