Industry News: asm flip chip machine (Page 1 of 17)

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

SMTA South East Asia Technical Conference on Electronics Assembly Program Finalized

Industry News | 2018-03-13 18:51:40.0

SMTA is excited to announce the technical program has been finalized and registration is now open for the South East Asia Technical Conference on Electronics Assembly. The event will be held May 8-10, 2018 at the MITEC in Kuala Lumpur, Malaysia.

Surface Mount Technology Association (SMTA)

Count On Tools Introduces Universal Instruments’ GSM Special Low Force Nozzle with Replaceable Tips for Delicate Components

Industry News | 2010-05-20 12:47:37.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.

Count On Tools, Inc.

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2016-08-23 16:25:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Practical Components to Highlight Latest Technology at SMTA International 2007

Industry News | 2007-10-04 23:11:30.0

LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

Surface Mount Technology Association (SMTA)

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine

Industry News | 2009-05-29 12:27:20.0

Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.

Siemens Process Industries and Drives

  1 2 3 4 5 6 7 8 9 10 Next

asm flip chip machine searches for Companies, Equipment, Machines, Suppliers & Information

IPC Training & Certification - Blackfox

High Throughput Reflow Oven
PCB Handling with CE

Training online, at your facility, or at one of our worldwide training centers"
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...