Industry News: asscon vp 3000 (Page 1 of 3)

Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly

Industry News | 2025-09-08 20:01:07.0

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The VP 2200 addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical, and industrial applications. The system delivers faster reflow processing, greater flexibility, and lower maintenance costs, building on the success of ASSCON's VP 2100 launched in 2021.

Altus Group

Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly

Industry News | 2025-09-15 11:27:27.0

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region. The VP 2200 addresses the growing demand for high-throughput, thermally challenging PCBAs in military, medical, and industrial applications. The system delivers faster reflow processing, greater flexibility, and lower maintenance costs, building on the success of ASSCON's VP 2100 launched in 2021.

Altus Group

Altus Helps Concurrent Technologies Plc. Scale Production Capacity with Advanced Inline Vapour Phase Technology

Industry News | 2025-12-01 13:16:18.0

Altus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.

Altus Group

Altus Adds a new Compact Vapor Phase Inline Soldering System to its 2022 Portfolio

Industry News | 2022-01-29 13:18:22.0

Altus has added to its vapor phase soldering product line-up with the introduction of the new 2100 vapor phase inline soldering system from ASSCON.

Altus Group

Altus Offer Energy Saving Solutions for Soldering

Industry News | 2022-09-26 06:44:01.0

The rising cost of energy is putting a strain on everyone, including those within the electronics industry. As wholesale gas and electricity prices continue to rise, finding solutions to reduce consumption is now a top priority for companies.

Altus Group

Seagate implements Asscon Vapor Phase

Industry News | 2013-09-17 17:21:25.0

Seagate Technology is a leading provider of hard drives and storage solutions. Founded in 1979, Seagate employees 50,000 people worldwide and is one of Longmont Colorado’s largest employers. The Longmont operation includes a small prototype design center providing manufacturing services to Seagate engineering teams , and is an integral part in process of taking a product from development to product launch.

A-Tek Systems Group LLC

CyberOptics’ 3D AOI System Honored with Innovation Award for Unmatched Speed and Accuracy

Industry News | 2015-04-22 14:57:26.0

CyberOptics® Corporation (NASDAQ: CYBE) announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its new SQ3000™ 3D Automated Optical Inspection (AOI) system. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The 2015 EM Asia Innovation Award is CyberOptics’ 20th industry award from the electronics industry.

CyberOptics Corporation

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Industry News | 2021-08-13 12:16:35.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.

CyberOptics Corporation

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Industry News | 2010-12-03 22:31:01.0

Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

i3 Electronics

CyberOptics to Present '100% Wafer Bump Metrology and Inspection' Technical Paper at the SEMICON Taiwan SiP Global Summit 2020

Industry News | 2020-09-06 04:37:56.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.

CyberOptics Corporation

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