Industry News: assembleon off line (Page 17 of 67)

Data I/O Announces New Distribution Partnership with Le Champ in SE Asia

Industry News | 2009-05-04 16:19:40.0

REDMOND, Wash. � May 4, 2009 � Data I/O Corporation (NASDAQ: DAIO), the leading provider of manual and automated device programming solutions, announces that the company recently completed a distribution agreement with Le Champ Pte Ltd.

Data I/O Corporation

Inovar Selects Electrovert’s Aquastorm 200

Industry News | 2012-04-18 20:00:21.0

Inovar has selected the Electrovert Aquastorm 200 as its in-line cleaner of choice.

Inovar, Inc.

Fancort Industries Introduces Value-Priced Floor Mounted PCB Depaneling Routers with Vision System

Industry News | 2014-06-18 20:16:34.0

Fancort Industries has introduced a new line of floor mounted PCB Depaneling Routers. The new models include the SM3320S-S Single Table, SM3350S-D Twin Table and SM4520L-D Twin Table for higher production requirements.

Fancort Industries, Inc.

Speedprint Appoints Red Rock Reps for the Western U.S.

Industry News | 2014-11-12 17:25:36.0

Speedprint Technology announces the appointment of Red Rock Reps as its manufacturers’ representative in the Western U.S. Chet Clark will represent Speedprint’s leading-edge stencil print technology throughout Colorado and Utah.

Speedprint Technology

Eunil to Exhibit at IPC APEX EXPO in San Diego

Industry News | 2017-01-17 15:27:24.0

Eunil will exhibit in Booth #101 at the upcoming IPC APEX Expo, scheduled to take place February 14-16 in San Diego, Calif. Eunil will exhibit its ELM-800 Laser Marker, ECM-1100 Coating Master, conveyors, and buffers.

Eunil H.A. Americas, Inc.

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Industry News | 2018-03-08 18:44:09.0

Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Industry News | 2018-09-27 17:08:37.0

Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

EMS Introduces Spin on Liquid Negative Photoresist NR-5000

Industry News | 2019-02-21 07:22:25.0

Engineered Material Systemsis pleased to announce the availability of its NR-5000 series liquid negative photoresists for microfluidics and wafer level metallization processes. These material formulations have viscosities optimized for wafer coatings from 5 to 50 µm in thickness.

Engineered Materials Systems, Inc.

The thinnest, smoothest metallic lines in the world helps speed up miniaturisation of electronic devices

Industry News | 2010-07-08 12:04:50.0

New method creates super-thin, high integrity, continuous metal lines that surpass today’s semiconductor industry requirements.

Institute of Materials Research and Engineering (IMRE)

Second generation of the MY500 at APEX 2008 MY500 � Jet Printing technology for higher profitability

Industry News | 2008-04-08 22:40:58.0

With greater PCB design flexibility, more precise solder paste placement and complete off-line preparation, the second generation of the MY500 offers you a vast array of ways to improve your profitability.

Mycronic Technologies AB


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