Industry News: assembleon off line (Page 43 of 67)

Techcon Systems Debuts New Product Catalog

Industry News | 2011-06-16 14:47:02.0

Techcon Systems, a product group of OK International introduces its updated product catalog.

Techcon Systems

Practical Components' Free Dummy Component Catalog Helps Save Money and Improve Production

Industry News | 2011-07-26 20:55:54.0

Practical Components announces that the illustrated 2011-2012 Dummy Component Catalog is complete, free of charge and now available.

Practical Components, Inc.

Bench Top Wind Tunnel Demonstrates ATS Innovations in Thermal Management Instrumentation

Industry News | 2011-07-28 18:27:19.0

Advanced Thermal Solutions, Inc, (ATS), continues its innovations in electronics thermal management with the BWT-104 Bench Top Wind Tunnel. The BWT-104 is a research quality, open loop wind tunnel for thermally characterizing components, circuit boards and cooling devices such as heat sinks, heat exchangers and cold plates.

Advanced Thermal Solutions, Inc

Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup

Industry News | 2011-11-08 14:17:32.0

Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

Practical Components Adds Test Board for 0.3 mm Pitch Dummy CVBGA Test Vehicle

Industry News | 2012-01-17 11:05:35.0

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Practical Components, Inc.

Enhancement Now Available for Techcon’s TS5440 Series Microshot Needle Valve

Industry News | 2012-03-28 17:09:06.0

Techcon Systems has enhanced the performance of its high-precision TS5440 Series Microshot Needle Valve to reduce maintenance costs and widen the application range

Techcon Systems

BPM Microsystems to Demonstrate New Solution for In-System Device Programming at the 2012 SMT Hybrid Packaging Exhibition

Industry News | 2012-04-27 13:44:41.0

BPM Microsystems will demonstrate its new in-system device programming solution in Hall 7, Stand 648 at the upcoming SMT Hybrid Packaging Exhibition, scheduled to take place May 8 - 10, 2012 at the Exhibition Centre Nuremberg in Germany.

BPM Microsystems, Inc.

Everett Charles Technologies Debuts “Plunge to Board” RF Probe Designs for Accurate and Repeatable Broadband Measurements

Industry News | 2012-06-15 17:31:01.0

Everett Charles Technologies (ECT) announces that it now offers a wide variety of high-frequency, controlled-impedance, spring contact probes for broadband measurement applications.

Everett Charles Technologies

KIC Introduces ProBot – The Profiling Robot That Perfects Your AOI and Batch X-Ray Inspection

Industry News | 2012-09-28 07:02:31.0

KIC today announced that the new ProBot will begin shipping effective October 2012.

KIC Thermal

Manncorp Brings High-Precision, Selective Soldering and Fluxing to the Bench-Top with the New ULTIMA Series

Industry News | 2012-10-09 16:18:14.0

The ULTIMA Series Selective Soldering and Fluxing Systems offer a new solution for soldering through-hole components and connectors to surface mount and mixed technology PCBs. Numerous engineering and design innovations have resulted in compact, bench-top systems loaded with features that deliver a level of performance that, until now, would have made selective soldering cost-prohibitive for many low- and medium-volume PCB assemblers.

Manncorp


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