Industry News | 2016-02-15 20:06:55.0
New opportunities and answers to industry challenges will abound as leaders in the electronics manufacturing industry debut cutting-edge products and services at IPC APEX EXPO®, March, 15–17, 2016, at the Las Vegas Convention Center. In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” a significant number of exhibitors will be introducing new products at the show. Exhibitors will also feature chemicals, materials, and equipment for PCB manufacturing, as well as design software and printed electronics.
Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2021-11-24 15:25:19.0
Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
Industry News | 2019-11-21 14:17:10.0
IPC’s Hand Soldering World Championship was held November 14 at productronica 2019 in Munich, Germany. This global event included 17 competitors representing companies in France, Hungary, Indonesia, Poland, Germany, Thailand, Malaysia, Korea, Vietnam, United Kingdom, Japan, India, China and the Philippines.
Industry News | 2018-10-18 09:54:05.0
The Value of Outsourcing PCB Assembly Manufacturing
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2018-10-18 10:29:29.0
The Benefits of Embedded Discrete Components
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