Industry News: automatic wafer (Page 2 of 16)

KIC’s e-Clipse Wins a 2010 NPI Award

Industry News | 2010-04-11 02:18:14.0

San Diego - KIC announces that it has been awarded an NPI Award in the category of Process Control Tools for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.

KIC Thermal

Virtual Industries Announces Availability of new WAFER-VAC System

Industry News | 2013-04-22 16:33:35.0

Virtual Industries Inc., announces the availability of its new WAFER-VAC system with 8" molded wafer tip (WV-9000-MW8).

Virtual Industries, Inc.

5th "Deep Dive" SMT Seminar

Industry News | 2010-04-29 08:33:15.0

SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits

Siemens Process Industries and Drives

Adept Technology Selected as Exclusive Robotics Partner for Innovative Electronics Assembly Machine

Industry News | 2007-11-01 20:59:31.0

LIVERMORE, Calif.--(BUSINESS WIRE)--Nov. 1, 2007--Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, announced that they have been selected as the robotics supplier by Chad Industries, a supplier of automat Circuit Board, Solar, and Wafer Handling, equipment, for their CHADIQ(TM) Odd Form Assembly Systems.

Adept Technology Inc.

KIC’s e-Clipse and SunKIC Profiler Win the 2009 Global Technology Award

Industry News | 2009-11-19 14:31:38.0

San Diego — November 2009 — KIC announces that two of its products, designed to increase solar cell efficiency through accurate profiling and process optimization, tied for a Global Technology Award. KIC’s e-Clipse solar cell thermocouple (TC) attachment fixture and compact SunKIC profiler tied in the category of Solar Manufacturing Products. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

KIC Thermal

BTU International to Launch Pyramax 100 Range at Productronica 2007

Industry News | 2007-11-01 20:23:59.0

Farnborough, UK -November 2, 2007� BTU Europe, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy generation markets, announces it will launch the Pyramax 100 range in hall A4, booth 141 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

BTU International

Nordson DAGE Expands into New Research and Development Facility Increased investment to support new product developments and innovation in Test and Inspection

Industry News | 2014-03-04 16:16:46.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces the official opening of its new expanded Research and Development facility in Colchester, Essex, UK.

Nordson DAGE

Virtual Industries to Debut New WV-9000 WAFER-VAC System at SEMICON West

Industry News | 2012-06-11 12:58:50.0

Virtual Industries Inc.announces that it will debut the new WV-9000 WAFER-VAC System for handling wafers and solar cells in Booth #2427 South at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Virtual Industries, Inc.

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

Inspect Wafers Straight from the FOUP with the New Nordson DAGE Quadra® W8 Automated Wafer X-ray Inspection System

Industry News | 2018-10-09 18:44:45.0

Nordson DAGE announces the launch of Quadra® W8, a versatile lab-based solution for wafer-level inspection offering industry-leading magnification and image quality. Integrated dual port EFEM provides complete wafer protection by removing any manual wafer handling so operators can inspect wafer level quality directly from the FOUP.

Nordson DAGE


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