Industry News: automatic wafer (Page 2 of 15)

Milara Receives Global Technology Award for Its Bumping System

Industry News | 2007-11-15 19:16:35.0

Medway, MA � November 15, 2007 � Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it has been awarded a Global Technology Award in the category of Wafer-level Products for its innovative AWPb 300.

Milara Inc

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Industry News | 2013-06-20 19:12:14.0

Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

Tresky AG

Cognex Wafer Reader Sets New Standard By Doubling The Processing Power

Industry News | 2011-08-03 21:32:16.0

Cognex Corporation has introduced its next-generation wafer identification (ID) reader and accompanying software, the In-Sight® 1740 series and In-Sight Explorer Wafer ID software version 4.5.0.

Cognex Corporation

KIC’s e-Clipse Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:17:30.0

San Diego — November 2009 — KIC announces that it has been awarded a Global Technology Award in the category of Solar Manufacturing Products for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

KIC Thermal

KIC’s e-Clipse Wins a 2010 NPI Award

Industry News | 2010-04-11 02:18:14.0

San Diego - KIC announces that it has been awarded an NPI Award in the category of Process Control Tools for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.

KIC Thermal

Virtual Industries Announces Availability of new WAFER-VAC System

Industry News | 2013-04-22 16:33:35.0

Virtual Industries Inc., announces the availability of its new WAFER-VAC system with 8" molded wafer tip (WV-9000-MW8).

Virtual Industries, Inc.

5th "Deep Dive" SMT Seminar

Industry News | 2010-04-29 08:33:15.0

SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits

Siemens Process Industries and Drives

Adept Technology Selected as Exclusive Robotics Partner for Innovative Electronics Assembly Machine

Industry News | 2007-11-01 20:59:31.0

LIVERMORE, Calif.--(BUSINESS WIRE)--Nov. 1, 2007--Adept Technology, Inc. (NASDAQ:ADEP), the leading provider of intelligent vision-guided robotics and global robotics services, announced that they have been selected as the robotics supplier by Chad Industries, a supplier of automat Circuit Board, Solar, and Wafer Handling, equipment, for their CHADIQ(TM) Odd Form Assembly Systems.

Adept Technology Inc.

KIC’s e-Clipse and SunKIC Profiler Win the 2009 Global Technology Award

Industry News | 2009-11-19 14:31:38.0

San Diego — November 2009 — KIC announces that two of its products, designed to increase solar cell efficiency through accurate profiling and process optimization, tied for a Global Technology Award. KIC’s e-Clipse solar cell thermocouple (TC) attachment fixture and compact SunKIC profiler tied in the category of Solar Manufacturing Products. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

KIC Thermal

BTU International to Launch Pyramax 100 Range at Productronica 2007

Industry News | 2007-11-01 20:23:59.0

Farnborough, UK -November 2, 2007� BTU Europe, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy generation markets, announces it will launch the Pyramax 100 range in hall A4, booth 141 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

BTU International


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