Industry News | 2016-12-02 11:33:11.0
One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.
Industry News | 2017-03-14 22:49:33.0
We would like to check if you have 2 units of 2nd hand ESEC 2009 SSI or 2007 FS DA machines, below is the details; Please advise the delivery terms & lead time.
Industry News | 2016-06-13 15:22:10.0
Nordson DAGE, a division of Nordson Corporation announces the opening of their Asian clean room demonstration facility. Located south of Seoul, Republic of Korea, close to Incheon International Airport and in the heart of South Korea’s technology base, this 102 m2 clean room and conferencing center provides all of their regional customers with access to Nordson DAGE’s award-winning 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.
Industry News | 2018-11-16 19:11:06.0
Nordson DAGE announces that it was awarded a 2018 Global Technology Award in the category of Test Equipment for its 4800 INTEGRA Automatic Wafer Bondtester. The 4800 is the complete solution for automated on wafer bond testing ensuring virtually operator free testing. It is specifically designed for advanced high-density interconnects in both front and back-end applications and utilizes recent advances in operator free technology. The Global Technology Awards recognize and celebrate innovation in electronics manufacturing. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts and the Award was presented to the company during a ceremony that took place during SMTA International.
Industry News | 2009-07-24 13:20:42.0
San Diego — July 2009 — KIC announces the release of the e-Clipse, a solar cell thermocouple (TC) attachment fixture.
Industry News | 2014-11-03 19:19:11.0
The Fastest Fully Automatic X-ray Metrology tool for Wafer Bumps and TSV’s.
Industry News | 2007-11-15 19:16:35.0
Medway, MA � November 15, 2007 � Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it has been awarded a Global Technology Award in the category of Wafer-level Products for its innovative AWPb 300.
Industry News | 2013-06-20 19:12:14.0
Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
Industry News | 2011-08-03 21:32:16.0
Cognex Corporation has introduced its next-generation wafer identification (ID) reader and accompanying software, the In-Sight® 1740 series and In-Sight Explorer Wafer ID software version 4.5.0.
Industry News | 2009-11-11 12:17:30.0
San Diego — November 2009 — KIC announces that it has been awarded a Global Technology Award in the category of Solar Manufacturing Products for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
