Industry News | 2023-06-26 09:16:29.0
If you plan on attending the Semicon West show in San Francisco, CA this year, make sure you stop by the Seica booth - #1561! Seica USA is an exclusive distributor for Osai Automation Systems, as well as Focused Test Inc. semiconductor test solutions. Seica has partnered up with these co-exhibitors in one large booth, with an assortment of Semiconductor handling and Power, GaN and SiC test solutions. And, as the world leader in Flying Probe test technology, Seica is where customers look for leading-edge wafer, probe card, and electronic board testing solutions.
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2016-04-01 23:53:56.0
Ahead of SMT Hybrid Packaging 2016 (26 to 28 April 2016), Erhard Hofmann, MD AdoptSMT explains what the company is showcasing in Nuremberg.
Industry News | 2013-02-27 11:15:11.0
Multitest, will exhibit in Booth #K4 at the Burn-in & Test Strategies Workshop (BiTS), scheduled to take place March 3-6, 2013 in Mesa, AZ.
Industry News | 2009-05-29 10:26:28.0
COLORADO SPRINGS, CO � May 2009 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display several advanced systems in booth 1968 at the upcoming Medical Design & Manufacturing East, scheduled to take place June 9-11, 2009 at the Jacob K. Javits Convention Center in New York, NY.
Industry News | 2010-11-03 21:54:19.0
Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2003-04-24 04:59:41.0
-- MicroFlex Delivers Affordable, Flexible Semi-Automatic Printing --
Industry News | 2012-01-21 00:40:52.0
Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.
