Industry News | 2002-01-17 12:39:06.0
Assembly Module
Industry News | 2009-07-28 11:24:11.0
San Diego — July 2009 — KIC announces the third and final link to KIC’s technologies for increased solar cell efficiencies — the Spectrum thermal process optimization software.
Industry News | 2009-12-07 18:59:37.0
KIC announces the third and final link to KIC’s technologies for increased solar cell efficiencies — the Spectrum thermal process optimization software.
Industry News | 2010-03-03 13:44:24.0
KIC will demonstrate the latest link to its technologies for increased solar cell efficiencies with its award-winning Spectrum thermal process optimization software in Bergen Associates Pvt. Ltd. booth #4-8 at PV+Solar India Expo 2010, which is scheduled to take place 4-6 March 2010 at the World Trade Centre in Mumbai, India.
Industry News | 2020-10-27 12:41:51.0
SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2013-01-14 14:43:06.0
Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2022-02-25 13:23:30.0
SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.
