Industry News | 2018-05-02 20:22:07.0
Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.
Industry News | 2010-03-24 13:47:45.0
Medway, MA - March 2010 - Milara Incorporated, a leader in stencil printing technological innovation, will debut its latest printing and placement equipment in booth 2219 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2009-09-26 16:32:37.0
DEK has launched its brand new Paste Roll Height Monitor, an easy-to-use productivity tool designed to eliminate defects and improve end-of-line yield. Using lasers to detect the presence of solder paste, the new technology monitors the height of the paste roll to provide operators with a new level of process control.
Industry News | 2009-11-24 22:09:36.0
Screen printing and mass imaging world leader DEK chose Productronica earlier this month to launch Sentinel, a breakthrough productivity-enhancing solution that lowers the cost of achieving more good boards from the stencil printing process.
Industry News | 2009-12-03 18:24:04.0
DEK has announced the launch of its new Over Top Snuggers (OTS) substrate clamping technology. Securing printed circuit boards firmly in place ready for processing, the flexible technology is designed to ensure high quality printing for enhanced end-of-line yield.
Industry News | 2010-05-11 14:53:59.0
DEK is preparing to take a whole host of innovative technologies to this year’s SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th – 10th June 2010. Stand 7-305 will showcase DEK’s productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products.
Industry News | 2019-01-05 16:26:04.0
SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
Industry News | 2020-09-01 12:27:21.0
Seika Machinery, Inc. is pleased to announce its participation in the SMTA International Virtual Conference & Exposition. The Live Virtual Expo is scheduled to take place Sept. 28-30, 2020. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2024-08-12 15:07:45.0
SHENMAO America, Inc. is pleased to announce the launch of its latest innovation, the Rosin-Free No-Clean Liquid Flux SM-ZR10, specifically designed for automatic wave soldering processes. The no-clean liquid flux offers superior soldering performance, easy maintenance, and compliance with stringent environmental standards.
