Industry News: automatic wafer (Page 10 of 16)

8th Finetech International User Meeting

Industry News | 2011-05-19 22:07:36.0

On September 29, 2011, Finetech will hold the 8th International User Meeting “Micro Assembly” in Berlin. This series of events aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.

Finetech

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Industry News | 2013-01-04 08:55:03.0

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

Finetech

SHENMAO Technology Inc. Exhibits at NEPCON Vietnam 2018

Industry News | 2018-10-01 20:19:19.0

SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO will introduce the PF606-P245 solder paste PF606-F13 as well as the PF604-JF3 solder wires.

Shenmao Technology Inc.

Semiconductor and Advanced Packaging Inspection at SEMICON Taiwan 2020

Industry News | 2020-08-07 05:21:03.0

Test Research, Inc. (TRI) is pleased to announce that it will be featuring Test and Inspection solutions for Semiconductor and Advanced Packaging Production Lines at SEMICON Taiwan 2020. Visit TRI at booth # J2534 to discover High-Precision Inspection for the Semiconductor Industry at Taipei Nangang Exhibition Center Hall 1.

TRI - Test Research, Inc. USA

Inspection Innovations at SEMICON Taiwan 2022

Industry News | 2022-08-14 14:16:58.0

Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.

TRI - Test Research, Inc. USA

Nordson DAGE to Exhibit Its New Camera Assist Automation at SEMICON West Showcasing the next generation of best-in-class bond testing technology

Industry News | 2013-06-10 12:32:44.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is pleased to announce that its newly developed camera assist automation system will be exhibited in Booth 5971 at the SEMICON West exhibition scheduled to take place on 9-11th July 2013 in San Francisco, Calif.

Nordson DAGE

Adhere to innovation and originality - Unicomp Technology 3D CT Inline X-ray won the "China SMT Innovation Achievement Award"

Industry News | 2021-12-20 04:12:01.0

2021 China South China SMT Academic and Applied Technology Seminar and China SMT Innovation Achievement Award Ceremony was held in Shenzhen on December 10. In order to build a good communication platform for SMT enterprises in South China and create opportunities for technical exchange, the SMT Academic and Application Technology annual meeting in South China is held every December by the SMT Special Committee of Guangdong Electronics Society. This annual meeting invited industry experts to explain the innovation direction of intelligent manufacturing SMT technology and SiP packaging, from PCBA to micro assembly, to solve the hot issues of high-density, thin and miniaturization of electronic products, especially mobile terminal electronic products in recent years.

Unicomp Technology Co., Ltd

SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816

Industry News | 2023-07-19 09:24:50.0

SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.

Manufacturers Demonstrate New Technologies at NEPCON/EMT South China 2009

Industry News | 2009-08-04 12:09:00.0

The 15th annual NEPCON/EMT South China 2009 event for the China electronics manufacturing industry will take place from August 26-28, 2009 at the Shenzhen Conference & Exhibition Center. When attending the NEPCON show, visitors will have the opportunity to take part in EMT South China, Finetech South China, ATE China and AE South China, which take place simultaneously.

Reed Exhibitions


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