Industry News: avoid popcorn bga (Page 1 of 3)

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly

Industry News | 2011-08-24 17:13:21.0

The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.

Association Connecting Electronics Industries (IPC)

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

New SIPLACE import function for irregular BGAs

Industry News | 2010-05-11 15:23:38.0

To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.

Siemens Process Industries and Drives

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

New US Webinars from Bob Willis

Industry News | 2013-07-29 10:26:09.0

Technology webinars for the US time zone are being set up to help provided flexibility and also avoid engineers having to get up early in the morning. Bob Willis workshops in the US are supplemented with his on demand and online webinars.

ASKbobwillis.com

Seika Machinery to Feature HIROX Digital Microscopes at IMAPS/NASA/JPL Topical Workshop & Exhibition

Industry News | 2009-09-17 16:43:33.0

TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, together with HIROX-USA, announces that it will highlight the HIROX series of digital microscopes at the IMAPS/NASA/JPL Topical Workshop & Exhibition on Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation, scheduled to take place Thursday, October 1, 2009 at the Radisson Hotel in Los Angeles.

Seika Machinery, Inc.

Viscom Introduces the New Software Release SI 7.47

Industry News | 2014-07-24 10:09:05.0

With this new Release, Viscom introduces numerous innovations and improvements in the area of inspection plan generation and analysis software for its inspection systems.

Viscom AG

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