Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2018-12-13 03:35:05.0
Pick And Place Machine
Industry News | 2009-06-09 04:57:14.0
Maximum Flexibility and Reproducibility in Selective Soldering
Industry News | 2009-12-07 18:55:54.0
Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-10-15 18:45:29.0
Seika Machinery today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018 at the Expo Guadalajara. Seika will discuss the latest equipment from McDry, Unitech, Sawa and MALCOM.
Industry News | 2019-08-19 22:58:44.0
Seika will showcase a complete line up of leading-edge equipment in Booth #410 at SMTA International. Products includes the latest models from McDry, Sayaka, SAWA, Unitech and MALCOM.
Industry News | 2018-01-24 22:13:50.0
Kurtz Ersa North America today announced plans to exhibit in Booth #1337 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The Ersa team will highlight a lineup of advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, VERSAFLEX-Ultra selective solder module and IR/PL 650 XL rework system.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2016-06-27 14:50:08.0
Eunil introduces the ELM-800 Laser Marker.
Industry News | 2001-04-10 10:56:20.0
Fairless Hills, PA
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