Industry News: axis z 3 (Page 4 of 85)

SMT TODAY NAMES THE NEW SMARTLOOP YIELD IMPROVEMENT SYSTEM FROM MIRTEC AND YXLON ‘BEST INNOVATION OF 2015

Industry News | 2015-09-30 16:50:32.0

MIRTEC and YXLON were awarded Best Innovation by SMT Today Magazine for the joint development of the SmartLoop yield improvement system during the recent SMTA International Conference & Exhibition. The award was presented to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division, and Keith Bryant, Sales Director for SmartLoop, on Tuesday, September 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The ‘Best Innovation Award’ recognizes clear visionary and transformative technology within the electronics manufacturing industry. This award showcases innovations that have not only addressed a need and solved a problem, but have also been used to drive improved efficiency and productivity of an organization.

MIRTEC Corp

MIRTEC AND YXLON RECEIVE JOINT GLOBAL TECHNOLOGY AWARD FOR THE NEW SMARTLOOP YIELD IMPROVEMENT SYSTEM

Industry News | 2015-11-12 20:58:32.0

MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.

MIRTEC Corp

MIRTEC Reports 81% Growth for First Half of Fiscal 2008

Industry News | 2008-07-03 21:21:50.0

OXFORD, CT � July 2, 2008 � MIRTEC Co. Ltd. announces that sales revenue for its North American Sales and Service Division grew by more than 81 percent for the first six months of fiscal 2008 with respect to 2007 results.

MIRTEC Corp

MIRTEC to Premier Its AOI Series at APEX 2008

Industry News | 2008-02-28 21:48:17.0

OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.

MIRTEC Corp

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp

MIRTEC TO PREMIER ITS COMPLETE LINE OF TECHNOLOGICALLY ADVANCED AUTOMATED OPTICAL INSPECTION SYSTEMS AT APEX 2010

Industry News | 2010-03-24 12:21:18.0

MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of AOI and SPI systems at APEX 2010.

MIRTEC Corp

MIRTEC To Premier Its Complete Line of Technologically Advanced Automated Optical Systems at IPC Electronics Midwest 2010

Industry News | 2010-09-01 22:03:07.0

MIRTEC, "The Global Leader in Inspection Technology", announced that it will premier its complete line of inspection systems at in booth #7617 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.

MIRTEC Corp

Mirtec To Premier Its Complete Line of Technologically Advanced Automated Optical Inspection Systems at SMTAI 2010

Industry News | 2010-10-01 00:32:52.0

MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its complete line of inspection systems at in booth #7326 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

MIRTEC Corp

MIRTEC to Premier Its Complete Line of Automated Optical Inspection Systems at APEX 2009

Industry News | 2009-03-16 18:07:28.0

OXFORD, CT � March 2009 � MIRTEC, �The Global Leader in Inspection Technology,� announces that it will introduce the latest advancements to its MV Series of AOI systems as well as unveil the company's first In-Line SPI System, the MIRTEC MS-11, in booth 147 at the upcoming APEX exhibition & conference scheduled to take place March 31- April 2, 2009 in Las Vegas.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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