Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
Industry News | 2014-01-24 16:51:33.0
At Southern Manufacturing 2014 AdoptSMT UK Ltd., member of AdoptSMT Group, will again present many new products for the European PCB Assembly Industry. The supplies, services and consultancy offered by AdoptSMT Group are focused around the aim to keep the customers production running.
Industry News | 2017-11-21 15:27:38.0
Viscom AG announces the release of vVision 2.4, successfully delivered since mid-2017 for its modern operating software. Among the most important optimizations are a time-saving inspection program creation – especially for new components and special component types – and comprehensive 3D advancements like the 3D solder joint inspection for chips.
Industry News | 2018-01-24 17:10:37.0
Viscom today announced plans to exhibit at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Calif. Constantly at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra gold, S3088 ultra chrome and S3088 SPI in Booth #1508.
Industry News | 2019-11-05 22:23:45.0
The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.
Industry News | 2014-10-01 13:31:21.0
Vi TECHNOLOGY announces that it was awarded two 2014 Global Technology Awards in the categories of Best European Product and Inspection – SPI for its Pi SPI system.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2018-11-14 15:34:52.0
Viscom AG will premier a new 3D bond inspection system at electronica 2018 in Munich. The Hanover-based inspection technology expert is thus expanding its diverse 3D product range from 3D SPI, 3D AOI and 3D X-ray technology to include bond inspection, further reinforcing its technology leadership in 3D inline inspection for the electronics manufacturing industry.
Industry News | 2013-10-28 14:45:08.0
Ersa, the specialist for electronic production equipment, has numerous highlights to present to the visitors of Productronica.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
.png)
