Industry News: bake pcb before reworking (Page 3 of 7)

Don’t Miss Ersa at the SMTA Empire Expo!

Industry News | 2018-04-22 19:20:59.0

Kurtz Ersa North America today announced plans to exhibit at the SMTA Empire Expo & Tech Forum, scheduled to take place Tuesday, April 24, 2018 at the Holiday Inn Syracuse/Liverpool in Liverpool, NY. The Ersa team will highlight its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa Hotflow 3/20, Smartflow 2020 and HR 550.

kurtz ersa Corporation

Ersa’s VERSAPRINT 2 Ultra Offers Fully Integrated 100 Percent 3D SPI – Learn More at the SMTA Wisconsin Expo

Industry News | 2018-04-27 10:18:13.0

Kurtz Ersa North America today announced plans to exhibit at the SMTA Wisconsin Expo & Tech Forum on Tuesday, May 8, 2018 at the Milwaukee Airport Crowne Plaza in WI. The Ersa team will highlight its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa Hotflow 3/20, Smartflow 2020 and HR 550.

kurtz ersa Corporation

Stencil Printer with Fully Integrated 3D SPI from Kurtz Ersa Inc. – Learn More at the SMTA Upper Midwest Expo

Industry News | 2018-06-05 17:23:22.0

Kurtz Ersa today announced that plans to exhibit at the Upper Midwest Expo & Tech Forum, scheduled to take place Thursday, June 14, 2018 at the DoubleTree by Hilton Minneapolis - Park Place in Minneapolis, MN. The Ersa team will highlight its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa Hotflow 3/20, Smartflow 2020 and HR 550.

kurtz ersa Corporation

Ersa to exhibit at SMTA LA / Orange County Expo

Industry News | 2018-10-25 15:44:12.0

Kurtz Ersa will exhibit at the LA / Orange County Expo & Tech Forum, scheduled to take place Thursday, Nov. 1, 2018 at the Grand Event Center in Long Beach, CA. The Ersa team will highlight its advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, Ersa Hotflow 3/20, Smartflow 2020 and HR 550.

kurtz ersa Corporation

Stencil Printer with Fully Integrated 3D SPI from Kurtz Ersa Inc. at SMTA

Industry News | 2018-09-17 19:40:41.0

Kurtz Ersa Inc.today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The Ersa team will showcase the VERSAPRINT 2 Ultra stencil printer and HR 550 in Booth #616.

kurtz ersa Corporation

Krypton Solutions chooses Ersa for reflow, rework, selective solder and stencil printing

Industry News | 2018-11-06 20:35:12.0

Kurtz Ersa today announced that Krypton Solutions LLC has invested in several new systems from Ersa for its new facility. A long-time Ersa customer with equipment at its Plano, TX facility, Krypton selected Ersa to help furnish its new facility in San Jose, CA.

kurtz ersa Corporation

VJ Technologies' ECAT Wins a 2010 VISION Award

Industry News | 2010-04-11 01:29:07.0

VJ Technologies, Inc. announces that it has been awarded a 2010 SMT VISION Award in the category of Packages/Passives/Connectors for its Edge Connector Assembly Tool (ECAT) Reflow System.

VJ Technologies, Inc.

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Valor to Feature Latest Software Solutions at APEX 2010

Industry News | 2010-03-27 16:40:49.0

RANCHO SANTA MARGARITA, CA - Valor Computerized Systems, Inc., global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces that it will feature its latest software solutions in booth #2228 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.

Valor Computerized Systems

New Photonic Soldering System For Selective Assembly.

Industry News | 2001-01-25 17:34:02.0

ViTechnology introduces the LS-200 for selective soldering and rework of all types of components, from BGAs to large QFPs and even odd-shaped and hybrid devices. This new system is ideal for soldering and desoldering RF shielding and various paste in hole and solder-paste-on-through-hole applications. The LS-200 offers high quality rework with fewer rejects, and a 30% shorter repair time when compared to hot air systems.

Vi TECHNOLOGY


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