Industry News | 2016-04-07 10:40:38.0
At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
Industry News | 2017-03-01 14:41:48.0
ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2018-01-24 20:59:22.0
Seika Machinery today announced plans to exhibit in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. Seika will showcase a complete lineup of leading-edge equipment, including the latest models from McDry, Sawa, Sayaka, HIOKI and MALCOM.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2024-01-29 11:33:44.0
Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Industry News | 2024-01-29 11:36:51.0
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Industry News | 2015-06-22 13:17:54.0
Insulectro (www.insulectro.com), a leading supplier of materials for use in the PCB and printed electronics industries, announced a breakthrough partnership to supply world-class performance copper foils manufactured by Oak-Mitsui throughout North America.
Industry News | 2016-05-21 08:04:11.0
Oak-Mitsui are proud to announce an expanded strategic partnership adding Oak Mitsui’s proprietary ABC (aluminum bonded copper) to Insulectro’s premier product portfolio including CAC (copper aluminum copper). By leveraging their bicoastal manufacturing locations, ABC will continue to manufacture its bonded product in Hoosick Falls, NY and Insulectro will continue to manufacture CAC at its facility in Lake Forest, CA. The complete line of Oak-Mitsui copper foils, on CAC and ABC, will be available in Insulectro’s inventory by June 17, 2016.
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